Thick film Technology consists of screened resistive, conductive and dielectric inks on ceramic-based materials. These inks, which are usually based on noble metals, are subsequently fired at temperatures ranging from 600°C to 850°C to form passive circuit components (i.e. resistors, capacitors) and conducting lines. The most common metals used are silver, gold, palladium, platinum and various combinations and alloys.
To complete the circuits, other passive and active component devices are typically attached by soldering. If required, a functional laser trim can be carried out for a custom device.
The conductor patterns can be multi-layer or double-sided (connected by moulded through-holes). The resistors can be trimmed to any size using computer-controlled laser trimming systems. Resistors can also be ratio-trimmed. Hybrids can incorporate SMD components or die components. The SMD components are auto picked, placed and attached by reflow solder technology. Typical lead configurations are SIP (single in-line packaged) or DIP (dual in-line packaged).
Advantage over PCB (THT/SMT)
Thermal Management: Ceramic Thick Film conducts the heat away from circuits, allowing greater circuit density and greater reliability allowing cooler operations. It excels over PCB by approximately 2.2 Watts per in2 for a 100°C increase.
Size reduction: P.C.B. through-hole circuits can be reduced on average by 50% - 65%.
Reliability: Many solder joints are eliminated by using screened resistors; circuits operate at lower temperature, thus increasing life expectancy.
Precision tolerance: Laser trimming of resistors allows precise sizes and ratios.
High voltage: Ceramic-based materials have a dramatically higher breakdown voltage compared to printed circuit boards, making it ideal for high voltages.
Resistor stability: Low Temperature Resistance Coefficient.
Designed by Telecontrolli