Design : The Telecontrolli design group offers its customers the best solutions when designing an electronic product using hybrid circuits. Layouts and artwork are performed in-house using Allegro Hybrid the interactive layout design tool by Cadence. Photoplots are generated on laser units (Barco Crescent 40).

 Printing and Firing : Screen printing operations are carried out on standard 96% Alumina substrates using automatic printers. All printing processes are carried out in a clean environment: screen production 2000 class, printing in 10,000 class and firing in 100,000 class. Special manufacturing processes can be carried out in a cleaner environment using a portable Clean Room in 1000 class.

 Telecontrolli can offer the following : fully automatic production processes during all the production phases, i.e. printing, drying and firing, fine line circuits up to 0.1 mm line/0.1 mm space can also be manufactured; ceramic panels up to 6” x 4”; multi layer circuits with up to four layers of conductors separated by dielectric layers more than 50 um thick, complete with laser-trimmed resistors on the top. All manufacturing parameters are controlled and recorded before and during the production process (e.g. thickness of the emulsion on the screen, thickness of the prints, and drying and firing temperatures of the furnaces).

 Laser Trimming : Resistor, capacitor and inductor trimming is a key element in thick film technology. Passive and active trimming are two areas where Telecontrolli has focused its research and plant investments. We are able to trim all passive components onto the substrates and to modify electric parameters, depending on size. We can perform active trimming, not only on resistors, but also on inductors and capacitors using our patented process. We can carry out fully automatic mass production (passive and active trimming); we can also use mechanical references for centering substrates (both sides) or pattern recognition.

 Laser Scribing and Drilling : Scribing and firing are performed using a 100 Watt CO2 laser. Multi position substrate fixturing allows maximum throughput for the standard process of scoring the multi circuit array from a 4” x 4.5” substrate. Substrate thickness varies from 0.025”, 0.030”, 0.035” and 0.040.

 The laser  can drill holes of various diameters (to accommodate double-sided hybrids) and cut a substrate outline to fit a specific customer's geometric application.

 Assembling and Testing 

Automated surface mount assembly equipment capable of placing from 0603 to BGA

Components can be on tape and reel, in stick tubes or waffle packs

Double-sided assembly capability

Stencil application of solder paste with automatic printing machinery

Convection oven soldering technology

SIP- and DIP-style lead frame

Potting of hybrid circuit assemblies

 Modular test systems based on the HPIB for testing 

Computer-controlled

Frequencies from DC to 3 GHz

Voltage levels from 1 mV to 5 KV, Ac or DC

Analog and digital circuitry

Active trim (parametric functional adjust)

Voltage levels from 1 V to 200 V, 0.5% accuracy

Frequency from DC to 1 GHz, 1% accuracy