Design & Manufacturing

Design Service

Working with your specifications, layouts and artworks are created by TeleControlli's designers using Cadence 'ALLEGRO HYBRID' layout design tools. Photoplots are generated on laser units (Barco Crescent 40).

Production Processes

• Fully automatic production processes i.e. printing, drying and firing
• Fine line curcuits up to 0.1mm line/0.1mm space
• Ceramic panels up to 6"x4"
• Multi layer circuits with up to four layers of conductors separated by dielectric layers more than 50μm thick
• Laser-trimmed resistors on the top

Printing

Screen printing operations are carried out on standard 96% Alumina substrates using automatic printers. All printing processes are carried out in a clean environment: screen production 2000 class, printing 10,000 class and firing in 100,000 class. Special manufacturing processes can be carried out in a cleaner environment using a portable Clean Room in 1,000 class.

Firing

All manufacturing parameters are controlled and recorded before and during the production processes (e.g. thickness of the emulsion on the screen, thickness of the prints, drying and firing temperatures of the furnaces).

Laser Trimming

Resistor, capacitor and inductor trimming is a key element in thick film technology. Passive and active trimming are two areas where TeleControlli has focused its research and plant investments. All passive components on the substrates can be trimmed to modify electric parameters, depending on size. The production team can carry out fully automatic mass production (passive and active trimming); they can also use mechanical references for centering substrates (both sides) or pattern recognition.

Laser Scribing and Drilling

Scribing and firing are performed using a 100 Watt CO2 laser. Multi position substrate fixturing allows maximum throughput for the standard process of the multi circuit array scoring from a 4"x4.5" substrate. Substrate thicknesses vary: 0.025", 0.030", 0.035" and 0.040". The CO2 laser can drill holes of various diameters to prepare double-sided hybrids and cut the substrate outline to fit your required dimensions.

Assembly

Versatile assembly:

• Automated surface mount assembly equipment capable of placing from 0603 to BGA
• Components can be on tape and reel, in stick tubes or waffle packs
• Double-sided assembly capability
• Stencil application of solder paste with automatic printing machinery
• Convection oven soldering technology
• SIP- and DIP- style lead frame
• Potting of hybrid circuit assemblies

Testing

Modular test systems, based on the HPIB, for computer-controlled testing of:

• Frequencies from DC to 3 GHz
• Voltage levels from 1 mV to 5KV, AC or DC
• Analog and digital circuitry
• Active trim (parametric functional adjust)
• Voltage levels from 1V to 200 V, 0.5% accuracy
• Frequency from DC to 1 GHz, 1% accuracy